Bluetooth 기술/시장동향 · 2015. 1. 22. · Wibree link layer specification Wibree link layer...
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Bluetooth Bluetooth 기술 기술/ /시장 시장 동향 동향 Bluetooth Bluetooth 기술 기술/ /시장 시장 동향 동향 18 Jul 2008 LG이노텍 MCM사업팀 장기철 책임
Transcript of Bluetooth 기술/시장동향 · 2015. 1. 22. · Wibree link layer specification Wibree link layer...
Bluetooth Bluetooth 기술기술//시장시장 동향동향Bluetooth Bluetooth 기술기술//시장시장 동향동향
18 Jul 2008
LG이노텍 MCM사업팀 장기철 책임
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SiliconSiliconVendorVendor
ModuleModuleVendorVendor
SetSetMakerMaker
S/WS/WVendorVendor
BluetoothBluetoothQualificationQualification
NitchNitchMarketMarket
CSRCSR
BroadcomBroadcom
TITI
InfineonInfineon
ALPSALPSMurataMurataKyoceraKyoceraTaiyo YudenTaiyo YudenSEMCOSEMCOLGITLGIT……
IVTIVTESIESI
(Chipset Mfg)(Chipset Mfg)
CetecomCetecom7Layer7LayerTUVTUVHYPERHYPER
Modile PhoneModile PhonePC MakerPC MakerConsumerConsumeretc...etc...
????
BluetoothS/W Stack
Ver 1.0
nn Open, Global MarketOpen, Global Marketnn Over 6,000 Company Participate in Bluetooth BusinessOver 6,000 Company Participate in Bluetooth Business
1. Value Chain1. Value Chain1. Market Trend1. Market Trend
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2. Bluetooth Applications2. Bluetooth Applications1. Market Trend1. Market Trend
The Bluetooth word mark and logos are owned by the Bluetooth SIG, Inc. (C) Bluetooth SIG, Inc. 2003-2006.
Music
Voice
HID
Data
Network Usage ModelPresenter Keyboard/Mouse
Tablet
NotePC
Phone
NotePC
Phone Car
Car
MP3/iPod
NotePC Phone
Consumer
MP3/iPod
PDA
NotePCPhone
AccessPoint
Camera
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3. Application Trend3. Application Trend1. Market Trend1. Market Trend
Music
Voice
HID
Data
Major Product Trend
Game Console & Controller Mouse
Mono Headset Car Handsfree
Stereo Headset Boombox Car Stereo TV & STB
Digital Pen
Digital Camera Printer
NotePC PDA & Smart Phone Watch
ü Note PC 본탑 가에 른 Mouse + Presenter 능 로확
ü Mobile Phone Input Device로확
ü Mono Headset 저가격, , 에한경 심화
ü 전 Handsfree는 Car Audio 및 PND 등로시 전환
ü Digital Camera는전송속 한계로WiFi 또는 UWB 를채택할가능성높 .
ü Printer는 USB Adaptor등 Option 선택ü Phone to TV/NotePC 사 전송 확
ü 향후비약적 확ü 특히 Car Audio 탑 가 격히ü Digital TV 수 확 에 른채택
ü Mobile 탑 가보편화ü ULP (Ultra Low Power) 보 시다양한
Sensor Application 제 등Blood Pressure Monitor
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n Mobile Phone's Bluetooth market be 66% overn Bluetooth total market glow >15% annually from CY08
*출처 : 체 석
4. Product Trend4. Product Trend1. Market Trend1. Market Trend
0.0
200.0
400.0
600.0
800.0
1,000.0
1,200.0
1,400.0
1,600.0
1,800.0
2006 2007 2008 2009 2010 2011 2012
Others
Game Controller
Game Console
Car Audio
Car Navi
PMP
HID
NotePC
Headset
Mobile Phone
단 : 백만개
ü ’08년 후 CAGR 15% 수
üMobile Phone 및 Headset 80% 상 Chipset 시 주
ü NotePC, PMP, Car Audio 시성 세를보 .
üGame 및주변 적뤄 고 나, 련업체는극히제한적 상태 .
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4. Product Trend4. Product Trend1. Market Trend1. Market Trend
n FCC approved product are increased very rapidly
FCC Approved Product
816
471
306
1,143
1,378
0
200
400
600
800
1,000
1,200
1,400
1,600
2003 2004 2005 2006 2007
Company Product Major Product
삼성전자 157 Mobile Phone/Headset
Nokia 65 Mobile Phone/Headset
LG전자 55 Mobile Phone/Headset
Motorola 43 Mobile Phone/Headset
Sony Ericsson 42 Mobile Phone
Panasonic 21 CE, PC, Automotive
Sony 21 Game, PC
High Tech Computer 15 PDA, Mobile Phone
GN Netcom 13 Headset
Micro Star International 12 PC
Unitech 12 PC
ASUSTeK Computer 11 PC
KYE Systems 10 Audio Equipment, ODM
Major Company
Source : FCC Equipment Authorization Search
ü FCC 승 2005년 후 격한 가세를나타냄.ü Set 신 Module 승 받는 Modular Approval 비 약 5% 정 로실제 Set는많 것 로추정
ü 승 업체수 : 464개 (2007년) * 2007년 FCC 승 Product수 10개 상업체
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*출처 : KETI 현황 석보고서 (2005)
5. Future Market Growth5. Future Market Growth1. Market Trend1. Market Trend
n Bluetooth integrated Mobile handset will be saturated to 60% by 2010
• 2006년약 5억개 Chipset 판매 상• 2011년 년간 40% 성• 2009년총 10억개 Bluetooth 제 판매
- ABI Research -
• Over 300M devices in 2005• Over 600M devices expected in 2006• Mobile phone penetration in 2005 was around 22% and expected to be close to 40% in 2006
• Over 10M units shipping per week
- IMS Research -
- Bluetooth SIG -
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21.7%
46.7%
3.2%
3.2%
12.8%
7.0%
0.3%
0.1%
4.9%26.2%
45.5%
1.2%
1.1%
5.9%
6.6%
0.1%
4.8%
8.6% Broadcom
CSR
Infineon
Nokia
Philips
Qualcomm
RFMD
ST
TI
CY2005 CY2006
6. Chipset Market Share6. Chipset Market Share1. Market Trend1. Market Trend
n CSR & Broadcom share almost Bluetooth mobile phone market
• Mobile Phone 시 CSR, Broadcom, Qualcomm 경합•저전력/복합화/다 능화에 Focus• Headset 시 CSR 주
* Source : TSR 2006
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1. Wireless Technology Landscape1. Wireless Technology Landscape2. Tech Trend2. Tech Trend
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IEEE LABEL TASKGROUP
WORKINGNAME
BASIC RF
WPAN 802.15
Low Speed 15.1 Bluetooth(1.1) 2.4GHz ISM, FM, Hopping
- 15.2 Co-existence na
High Speed 15.3 2.4GHz OFDM, DQPSK, AQM Trellis Coding
- 15.3a WiMedia-MBOA UWB, MBOA : 3~8GHz, SB : 3~5GHz
- 15.3c TG3c 57~64GHz, mmWave
Low Speed/Power 15.4 Zigbee 868,900MHz, 2.4GHz ISM, BPSK, O-QP나
Location/Ranging 15.4a TG4a UWB Impulse Radio or Chirp Spread Spectrum (2.4GHz)
Low Speed/Power 15.4b TG4b 15.4 Enhancement, New Freq. Allocation
Mesh Network 15.5 TG5 Determine PHY/MAC for Mesh Networking
WLAN 802.11
Medium – High Speed 11a,b,g,h Wi-Fi 2.4GHz, 5.6GHz DSSS or OFDM, BPSK thru 64QAM
Half Rate 11a TBD DSRC 5.9GHz
Higher Speed 11n HTSG 2.4GHz, 5.6GHz Use of MIMO possible
WMAN 802.16
High Speed P2P 16 MMDS, LMDS 10~66GHz
High Speed, Various MAC options including Mesh
16a WiMax 2~11GHz Licensed. 5~6GHz unlicensed.
Single Carrier. BPSK through to 56QAM.
200 carrier OFDM – The most popular
2. WPAN Standard2. WPAN Standard2. Tech Trend2. Tech Trend
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~10km
~200m
IP NetworkIP Network
WWAN
WLANCDMA/EVDO
WCDMA/HSDPA
WPAN
* WPAN : Wireless Personal Area Network* WLAN : Wireless Local Area Network* WWAN : Wireless Wide Area Network
~10m
IP Network 무선접속
Wi-FiWi-Bro
동 신망 한 Data 접속
WMODEMWiMAX
간 Cable Replacement
BluetoothZigbeeUWB
3. Wireless Network3. Wireless Network2. Tech Trend2. Tech Trend
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• Quick evolution in storage capacity and functionality in mobile phones and other electronic devices
• Choice between developing our own radio or building on another industry standard
• Synergies in co-operation as outlined in our umbrella vision
• 1+1 is morethan2• Wireless creates new opportunities
– more than 3,000 Bluetooth products on the market
4. Bluetooth SIG Vision4. Bluetooth SIG Vision2. Tech Trend2. Tech Trend
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Source CSR, 2006
4. Bluetooth SIG Vision4. Bluetooth SIG Vision2. Tech Trend2. Tech Trend
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5. Emerging Tech - NFC5. Emerging Tech - NFC2. Tech Trend2. Tech Trend
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• Bluetooth Simple Pairing– Integrate connectivity bundle
(NFC, BT, Wi-Fi, GPS, FM Radio) and drivefunctionality (e.g. headsets, data sharing)
– Challenge-NFC Secure Element– Bluetooth v2.1+EDR support NFC based
simple pairing mode
• Bluetooth SIG Interest Up– Bluetooth handset penetration surpasses
70% by 2010 – Share 30+ use case experience with NFC
Forum groups to guarantee interoperability– NFC enhances BT relevance
NFC Bluetooth-Enabled Phones by Phone Type, World Market, Moderate Forecast,
2006-2011 (Source: ABI Research)
5. Emerging Tech - NFC5. Emerging Tech - NFC2. Tech Trend2. Tech Trend
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MBOA (Multband-OFDM) DS-UWB
주파수 14개 ( 역폭: 528MHz) 3.1~4.9GHz, 5.825~106GHz
변조방식 OFDM (128 FFT)/QPSK CDMA(M-BOK)/BP나
코 방식 Convolutional Code Convolutional Code
전송률 55 ~ 480 Mbps 28.5 Mbps ~ 1.2 GHz
다 접속방식 Time/Frequency Hopping 4 CDMA code set
회로복 FFT/IFFT 조 Rake Receiver 조
고속WPAN한Altern-
ative PHY적
로 TG 3a 발족
2003년 1월 2003년 5월 2005년초 현
총 23개제안서접수
(FreescaleDS-UWB, Intel 등MBOA)
투 실시à양측 75%
확보실패, 현
경합
현 로선 IEEE
가사실상
정
IEEE 802.15.3a UWB
6. Emerging Tech - UWB6. Emerging Tech - UWB2. Tech Trend2. Tech Trend
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6. Emerging Tech - UWB6. Emerging Tech - UWB2. Tech Trend2. Tech Trend
• Bluetooth SIG device to co-operate with WiMedia Alliance.
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Wibree is the first wireless technology to solve the following needs in a single solution.- Ultra low peak, average & idle mode power consumption - Ultra low cost & small size for accessories & human interface devices (HID) - Minimal cost & size addition to mobile phones & PCs - Global, intuitive & secure multi-vendor interoperability
Wibree device architectureWibree specification has been created by having two equally important implementation alternatives in mind, namely dual-mode and stand-alone. In the dual mode implementation the Wibree functionality is an add-on feature inside Bluetooth circuitry sharing a great deal of existing functionality resulting in a minimal cost increase compared to existing products. The dual modes are targeted at mobile phones, multimedia computers and PCs. The stand alone implementations are power and cost optimized designs targeted at, for example, sport, wellness, and human HID product categories.
Wibree radio specificationWibree radio specification enables dual-mode implementations to reuse Bluetooth RF part but also to guarantee ultra low power consumption for devices with embedded stand-alone implementation of the Wibree specification. Wibree operates in 2.4 GHz ISM band with physical layer bit rate of 1 Mbps and provides link distance of 5-10 meters.
Wibree link layer specificationWibree link layer provides ultra low power idle mode operation, simple device discovery and reliable point-to-multipoint data transfer with advanced power-save and encryption functionalities. The link layer provides means to schedule Wibree traffic in between Bluetooth transmissions.
Wibree host & profile specificationsIn the first phase Wibree provides sensor, HID and watch user interface profiles.
7. Emerging Tech – WiBree (ULP)7. Emerging Tech – WiBree (ULP)2. Tech Trend2. Tech Trend
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BT Profiles
L2CAP
Link Manager (LMP)
Link Controller (LC)
RF RF
LC
LMP
LL
PAL
WiBree ProfilesBT Profiles
L2CAP
Admission Control
HCI HCI Extension
DuM
o m
anager
Physical Layer (PHY)
Link layer (LL)
HIF
PAL
WiBree Profile
Bluetooth Stack DuMo Stack WiBree Stack
WiBree protocol stack with the Bluetooth protocol Stack
WiBree Technology
7. Emerging Tech – WiBree (ULP)7. Emerging Tech – WiBree (ULP)2. Tech Trend2. Tech Trend
• WiBree is a new standard for ultra low power application like as watch and sensor.
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8. Bluetooth Specification Roadmap8. Bluetooth Specification Roadmap2. Tech Trend2. Tech Trend
LisbonLisbonLisbonLisbon
SeattleSeattleSeattleSeattle
üSupport for UWB high speed ChannelüSupport Broadcast & Multicast Channel
üExtended Inquiry Responseprovides more information during the inquiry procedure to allow better filtering of devices before connection. This information includes the name of the device, and a list of services, with other information.
üSniff SubrateReducing the power consumption when devices are in the sniff low power mode, especially on links with asymmetric data flows. Human interface devices (HID) are expected to benefit the most with mice and keyboards increasing the battery life from 3 to 10 times those currently used.
üQuality of Servicethese will enable audio and video data to be transmitted at a higher quality, especially when best effort traffic is being transmitted in the same piconet.
üSimple Pairingthis improvement will radically improve the pairing experience for Bluetooth devices, while at the same time increasing the use and strength of security. It is expected that this feature will significantly increase the use of Bluetooth.
Bluetooth 2.1 features
Bluetooth 3.0 features
26-Jul-2007 Released
Q2/2008
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Bluetooth Protocol Stack Bluetooth Profiles
9. Profiles9. Profiles2. Tech Trend2. Tech Trend
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• Class1- Power : Max 20 dBm- Application
Access PointMobile(One-phone)USB DongleWireless SPK
RAM
DSP
MCU
ROM
I/O
UART/USB/SDIO
PCM
Coexistence
BT wake/Host wake
BALUN
BPF
CrystalTCXO
EEPROMOr
Flash
Host Interface
Voice Interface
Debug or F/W Download
RESET
SPI/JTAG
Reset
Wake up control
Power/GND
Power/GND
WLAN Coexistence
Clock
LPO LPO
Memory
Clock IN/Request Out
LPO IN
Memory
Antenna
RF In/Out
BALUNSW
2.4GHzRadio
LNA
PA
• Class2- Power : -6~4 dBm- Application
Mobile phonePDAMP3
RF+BB Single Chip
10. Bluetooth Module10. Bluetooth Module2. Tech Trend2. Tech Trend
• Class1.5- Power : 10 dBm
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10. Bluetooth Module10. Bluetooth Module2. Tech Trend2. Tech Trend
점 단점
Substrate LTCC • 판내에 Filter등 Passive 내 가능. 소형화에 리
• Size가클경 Cost 가
•내 Passive 량 한계
Internal
Component
with X-Tal •안정적성능
• Set 에서 Clock Source 를공 하어려 경 적합
• Cost & Size 가
• Phone 경 내 TCXO 공 가능 로필
with E2PROM • RF 성능 련 Matching 값저 로고성능 및 Set에서 별Calibration 공정 필
• Cost & Size 가
• Set 공정전문화시내 화가능
성에 른 /단점
별Module 성
Low Cost Mid Cost High End Stand Alone
성
적 야
HCI
HOST
Multimedia
Module
HOST
Stack
Profile
GUI
All-In-One
Module
HOSTGUI
DSP/Stack
Profile
BT HCI
GUI
Profile BT
Chipset DSP/Stack
Profile
Mobile PhoneNotePC/PDA/PMP
Car StereoHost Resource ↓
High-End Car Stereo부가 기능 내장 (DSP)
HeadsetMouse/Keyboard 등
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Description
LBRQ-2B43 is a Class 2 (4dBm) Bluetooth® RF module for mobile phone with any of the Bluetooth®
enabled QUALCOMM MSM chipset.
Features- Dimension : 4.5x3.2x1.2mm- Temperature Range : -30℃ ~ +75℃- Supply Voltage :
VDD_BAT – 1.9V to 3.6VVDD_MSM – 1.62 to 2.92V
- Output Power : +1dBm (Typical) Class 2- Sensitivity : -87dBm (Typical)- Interface : BlueQ- Bluetooth® Specification Ver1.1, 1.2 Compliant
10. Bluetooth Module10. Bluetooth Module2. Tech Trend2. Tech Trend
• LTCC substrate is used mostly at mobile Bluetooth module.
LTCC : Low Temperature Co-fired Ceramic
<RF Module> <HCI Module>
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11. Chipset Roadmap11. Chipset Roadmap2. Tech Trend2. Tech Trend
20062006 20072007 20082008
Standard BT2.0+EDR BT2.1+EDR BT3.0
Silicon 130nm 65nm
BT+BT+UWB PHYUWB PHY
BT+BT+UWB PHYUWB PHY
BT+BT+FM RxFM RxBT+BT+
FM RxFM RxBT+BT+
FM Rx/TxFM Rx/TxBT+BT+
FM Rx/TxFM Rx/Tx
BT+BT+NFC/RFIDNFC/RFID
BT+BT+NFC/RFIDNFC/RFID
BT+BT+GPSGPSBT+BT+GPSGPS
BT+BT+FM+WiFiFM+WiFi
BT+BT+FM+WiFiFM+WiFi
BT+BT+DVBDVB--HH
BT+BT+DVBDVB--HH
Chipset
Source : CSR, Broadcom, TI
• Main trend of Bluetooth chipset is a convergence networking
