Enseignant(s) / Instructor(s) Shea Herbert: MT Langue / Language EN

Programme(s) Priode(s) Nombre d'heures /Hours per week

Spc / filire /orient Type

Microtechnique (2005-2006, Master semestre 1) Cours:2 2 3 5 opt

Objectifs:

L'tudiant dveloppera une solide comprhension des principauxmodes de dfaillance mcaniques et lectriques des microsystmes.Il apprendra comment acclrer ces dfaillances afin de prdire (etd'amliorer) la dure de vie des microsystmes. L'tudiant adopteraune approche de "conception pour la fiabilit" pour lesmicrosystmes.

Contenu:

Introduction: Vue d'ensemble des diffrents microsystmes et deleurs contraintes du point de vue de la fiabilit. Statistiques de fiabilit et modles: Tests acclrs, modlesstatistiques pour la fiabilit et applicabilit de ces modles pour lesmicrosystmes. Outils et Techniques: Techniques de mesure et de caractrisationrequises pour les microsystmes dans le cadre d'tudes de fiabilit.Outils pour tests acclrs. Fiabilit lectrique: Courts-circuits, chargement et claquage desdilectriques, corrosion, ESD, lectromigration. La fiabilit enmicrolectronique sera prsente et contraste la fiabilit enmicrosystmes. Techniques pour augmenter la dure de vie. Fiabilit mcanique: Stiction, frottement, fatigue, dformationplastique, effet de chocs et de vibrations. Techniques pour acclreret liminer des modes de dfaillance par meilleure conception, choixde matriaux, et packaging. Conception pour la fiabilit: Rgles de conception et approchemultidisciplinaire pour assurer la fiabilit du microsystme.

Forme d'enseignement:

En anglais

Forme du contrle:

Test crit et projet

Objectives:

The student will gain a fundamental understanding of the principalmechanical and electrical failure modes of a variety of microsystems. Hewill learn how to accelerate those failures, and hence predict and improvethe lifetime of microsystems. The student will adopt a design-for-reliabilityapproach by concurrently developing design, fabrication, and packagingstrategies to maximize the reliability of a microsystem.

Content:

Introduction. Overview of the different types of microsystems, and thevarious constraints they operate under. Examples will be given ofcommercial MEMS and how reliability can be a barrier tocommercialization. Reliability Statistics and Modeling: Accelerated testing, bathtubcurve, standard statistical models and applicability to microsystems. Tools and Techniques: Measurement and characterization techniquesneeded to measure microsystems for accelerated testing. Tools foraccelerated testing. Electrical Reliability: Open and short circuits, dielectric charging andbreakdown, corrosion, ESD, electromigration. Reliability in themicroelectronics field will be presented and contrasted with reliability inmicrosystems. Techniques to improve lifetime Mechanical Reliability: Stiction, friction, wear, fatigue, crack growth,creep, effect of shock and vibration, delamination. Discussion of how toaccelerate and therefore how to eliminate failure modes by improveddesign, packaging, materials choice, actuation technique. Design for Reliability Paradigm: Design rules and multidisciplinaryapproach to building reliability into the microsystem from the beginning.

Form of teaching:

In English

Form of examination:

Written test and project

Bibliographie:

"Reliability and Failure of Electronic Materials and Devices", by Milton Ohring

Titre Reliability of MEMS

Title Reliability of MEMS

Matire examine / subjects examined Reliability of MEMS

Session PRI Coefficient / Crdits ECTS 2 Forme de l'examen / Form of examination Ecrit