Inc. Technologies, are Embedded RTD 2010 Copyright © All...

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4 / Winter 2010 PC/104 and Small Form Factors

COLUMNS 6 Small Form Factor SIG Enabling SFF systems: More than just CPUs

By Paul Rosenfeld

7 PC/104 Consortium Promotions and spec revisions on tap for

next year By Jim Blazer

8 Euro Small Tech Small controllers push shopping cart production

By Hermann Strass

26 Editor’s Insight SFF Rx for medical device design challenges

By Jennifer Hesse

WEB RESOURCES Subscribe to the magazine or E-letter

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Submit: http://submit.opensystemsmedia.com

2010 OpenSystems Media® © 2010 PC/104 and Small Form FactorsAll registered brands and trademarks in PC/104 and Small Form Factors are property of their respective owners.ISSN: Print 1096-9764, ISSN Online 1550-0373

Published by:

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E-CASTSRegister at http://ecast.opensystemsmedia.com

Enabling Telehealth Devices with Embedded ComputingPresented by Microchip and GrammatechNovember 16, 2 p.m. EST

Four Key Strategies for Enabling Innovation in the Age of SmartPresented by IBMNovember 17, 2 p.m. EST

Take Your Design to the Next Level with Intel AtomPresented by Advantech, Microsoft, Intel Embedded AllianceDecember 14, 2 p.m. EST

Volume 14 • Number 5

FEATURES

10 THE BIG YET SMALL PICTURE Mission interoperable

Achieving compatibility by standardizing SFF designs

By Robert A. Burckle, WinSystems

16 Outside the black box: Focusing designs on I/O

By John Hentges, ACCES I/O Products

20 BUYER’S GUIDE 2011 PC/104 and Small Form Factors Buyer’s Guide

3.5-inch COM Express COM/SOM Industrial automation Mini-ITX Packaging and power supplies PC/104 PC/104-Plus PCI/104-Express

Pico-I/O Rugged/Mil-Spec SUMIT

Pico-I/O Rugged/Mil-Spec SUMIT

ON THE COVER:SFFs require interoperability to allow different manufacturers’ products to work together like gears in a well-oiled machine. Designers’ mission, if they choose to accept it, is to build compatible components by adhering to industry standards and using proven interconnect technologies.

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EMBEDDED SYSTEMSMilitary

8 ACCES I/O Products, Inc. – USB embedded I/O solutions11 Advantech Embedded Group – Intel Atom E6xx

processor series2 Diamond Systems Corporation – Blurring speed

in a remarkably small package25 EMAC, Inc. – Low cost, low power PC/104+13 Excalibur Systems, Inc. – Dense?9 IEI Technology USA Corp. – Fanless Intel Atom D525

processor family27 LiPPERT Embedded Computers – Embedded PCs

COMplete19 Logic Supply – Extreme environment solutions9 RAF Electronic Hardware – RAF male-female stacking

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3 RTD Embedded Technologies, Inc. – Catch the express

14, 15 RTD Embedded Technologies, Inc. – HighRel PC/104 ISA, PCI & PCIe modules and systems

5 Technologic Systems – TS-WIFIBOX-27 Tri-M Systems Inc. – PC/104 FlexTainer rugged

aluminum enclosure25 Tri-M Systems Inc. – Intel Pentium M 745 1.8GHz,

2MBL2, ATX24 VersaLogic Corp. – The Leopard moves FAST!17 WDL Systems – The power inside tomorrow’s

technology28 WinSystems, Inc. – Embedded Atom SBC with

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I’ve written earlier about SFF-SIG’s holistic view of the Small Form Factor (SFF) market and the need for multiple standards in various technology arenas to truly enable the design and imple-mentation of open, interoperable SFF systems. The need goes far beyond that for SFF CPU and I/O boards. Other areas for consid-eration of new standards include memory modules, display inter-faces, thermal solutions, enclosures, and more. In reality, this is a lot easier to talk about than to do. Each of these areas has its own set of experts and suppliers. It’s tough to get a bunch of CPU sup-pliers to talk about I/O boards. It’s even tougher to get them to talk (intelligently) about enclosures and display interfaces.

SFF-SIG has indeed delivered in this space by issuing standards for inter-faces (SUMIT and COMIT), form fac-tors for CPU boards (SUMIT-ISM and Pico-ITXe), I/O boards (SUMIT-ISM and Pico-I/O), and replaceable expan-sion storage (MiniBlade). Despite this success, I’d certainly hoped to be farther along on “other areas for consideration” by this time. To do so requires bringing together key experts in these other areas to define new standards under SFF-SIG auspices. SFF-SIG is much more about broad member involvement and healthy debate than simply rubber-stamping ideas submitted by members.

That said, I am pleased to report signifi-cant progress in one of these areas – rugged SFF memory expansion. Our investigation into this area was based upon the supposition that standard SODIMM solutions are inadequate for rugged, high-reliability applications requiring superior resistance to shock and vibration, even with clips, straps, glue, or other tie-down mechanisms. We also considered that soldering memory chips directly onto a CPU board has been shown to result in prod-uct mix, forecasting, and inventory challenges, and is desirable primarily for custom CPU boards.

In July, SFF-SIG initiated a Rugged Memory Working Group under the leadership of Virtium Technologies. Four memory suppliers and four manufacturers of SBC and COM CPU prod-ucts have provided input and participated in this working group. After much discussion, the group narrowed down a potential

solution and test-marketed its general parameters with a variety of CPU manufacturers outside of SFF-SIG. The results were positive, with excellent feedback regarding how to make the solution applicable across a wide variety of CPU solutions and form factors, even with form factors not currently supported by SFF-SIG members.

The group is working to fully define the specification and will initiate testing to determine if the solution truly meets the needs

of rugged SFF systems. We expect to announce the details of the specifica-tion in early 2011. Meanwhile, the draft specification will only be available to SFF-SIG members.

This experience only serves to reinforce the perspective that industry subject-matter experts are needed to drive stan-dards as we move outside the realm of CPU and I/O boards. SFF-SIG is provid-ing a “big tent” for members from various technology areas to meet and discuss the unique needs of SFF systems. In the case of the Rugged Memory Working Group, we have the technology suppliers (the memory suppliers) in a give-and-take debate with technology users (the SBC and COM suppliers) to ensure that the solution is viable and meets real needs in the market.

SFF-SIG welcomes proposals and participation from other tech-nology suppliers to initiate and drive efforts in the SFF space. While each of these individual areas has its own well-established standards group, no other organization has the SFF focus that is critical to the growth of the embedded market going forward. This focus is orthogonal to each of the individual building blocks, but is essential to tackle the overarching system trade-offs. Your expertise is both welcomed and respected. Information about the SFF-SIG can be found at www.sff-sig.org.

Small Form Factor [email protected] www.sff-sig.org

Enabling SFF systems: More than just CPUs


“It’s tough to

get a bunch of CPU

suppliers to talk about

I/O boards. It’s even

tougher to get them

to talk (intelligently)

about enclosures and

display interfaces.”

PC/104 Consortium 916-270-2016 • [email protected] • www.pc104.org

The annual PC/104 and Small Form Factors Buyer’s Guide signals that we are nearing the end of the year, and the global economy has many saying good riddance. The PC/104 Embedded Consortium is looking ahead to next year by planning how to best promote the PC/104 architecture worldwide.

For the past year, the PC/104 Embedded Consortium has concentrated on advancing our specifications and reviewing technical proposals for our specifications. Our Marketing Committee, headed by Michele Kasza of Connect Tech, continues to do an excellent job. The committee planned and coordinated trade shows, media opportunities, and website activities. Next year’s activities include attending the ESC Silicon Valley, Real Time & Embedded Computing Conference Santa Clara, and Embedded World trade shows. Other committee efforts will involve articles, press releases, and incremental website updates.

The Consortium will continue to provide member benefits including media partner programs offering user surveys and discounted print and online sponsorship opportunities. Our media partners have developed articles and placement options and encouraged member-contributed articles. The Consortium is always looking for article ideas, so if there is a PC/104-related topic you have been waiting to read about, contact the PC/104 Embedded Consortium office at [email protected].

Technical Committee Chairman Jonathan Miller of Diamond Systems is working on a major specification revision that should be out for member vote soon. I can’t really say much about it yet, as it has not been publically released, but I’m sure it will once again advance the stackable PC to the benefit of all members.

If you have not visited the PC/104 Consortium website at www.pc104.org lately, I encourage you to do so. We have been making additions and continuous improvements to the site. The board plans to open a design examples section sometime next year. The website allows you to keep abreast of the latest specifications for free and provides a product section where you can search by specification, member company, product type, or keyword. The product directory includes a picture, description, hotlinks, and company contact info for each product. If your company does not have its products listed in the directory, you are missing a great benefit of Consortium membership.

It is critical for the PC/104 Embedded Consortium to present a clear and focused presence of PC/104 technology to avoid confusion in the marketplace. We must protect the Consortium’s trademarks, copyrights, and IP to safeguard members’ investments. We will continue monitoring technological advancements for possible inclusion into the PC/104 architecture.

The PC/104 Consortium fosters open communications with members through its open member forum at every board meeting and keeps technical and marketing committees open to voting and nonvoting members (as observers). If you are interested in participat-ing in the PC/104 Embedded Consortium or on a committee, contact Jeff Milde at the PC/104 Consortium office.

Promotions and spec revisions on tap for next year

PC/104 and Small Form Factors Winter 2010 / 7

Welding under SFF controlIn 1937 Sylvan Goldman invented an early version of the shopping cart, called a “folding basket carrier,” which had a pair of large wire baskets attached to tubular metal arms with four wheels. In 1950 Rudolf Wanzl patented the stackable shopping cart as we

Small controllers push shopping cart productionuse it today (see Figure 1). The inventor founded Wanzl GmbH, which is currently the world’s largest producer of shopping carts, with 40 percent market share in China and 80 percent in Germany. Wanzl also produces similar equipment for air-ports, hospitals, and warehouses. Most of these products are made from welded steel wire nettings of different sizes and geometries.

High-quality welding machines have a long lifespan. The welding process does not change over time; however, the con-trol electronics need to become faster, more flexible, and more precise. Wanzl is replacing older electronic control systems on its welding equipment with modern Speedway-767 small form factor modules from WAGO. These modules are positioned directly on the large machines, which they control in a decentralized setup, and are linked together and to upper-layer controllers using industrial Ethernet or fieldbus (see Figure 2).

The Speedway-767 system family includes master modules (75 mm x 117 mm) for uplink communication and up to 64 I/O modules (50 mm x 117 mm) per master module for connection to sensors and actors. All modules are linked via a serial cable bus. Because of the dis-tance between the modules (up to 500 m total), a backplane bus cannot be used. Mechanical mounting on a C-Clamp (DIN-rail) is optional.

Flexible electronic control is needed to precisely weld different diameter steel wires into nets of different geometries. Wires are held in position by magnets until welded. The distributed processor and I/O modules are linked via the serial bus for reliable operation in an electromagneti-cally polluted environment. Measuring 25 mm or more in height, the individually enclosed SFF boards are ingress-protected according to IP67 (akin to NEMA 6.6P), ensuring protection against dust and water. The fanless system has an operat-ing temperature range from -25 °C to


+65 °C. Uplink communication is pro-vided via industrial Ethernet (EtherNet/IP, PROFINET, SERCOS III) or fieldbus (CANopen, MODBUS, PROFIBUS). The software tool WAGOframe is used to set parameters according to standardized Field Device Type/Device Type Manager (FDT/DTM) procedures. A CoDeSys soft-ware package based on the IEC 61131-3 standard is supplied with Speedway-767 systems.

Industrial technology eventsWAGO exhibited its products at two recent events in Germany. MOTEK, an interna-tional trade fair for assembly line and pro-duction handling automation equipment, was held September 13-16 in Stuttgart. Colocated with MICROSYS, a nano-technology trade show, and BONDexpo,

an industrial bonding technology trade show, MOTEK covered topics including mechatronics, education and research, and medical equipment assembly. More than 1,000 companies from 23 countries presented their products to more than 31,000 experts from 82 countries.

InnoTrans, one of the world’s most prom-inent trade fairs for railway technology, was held September 21-24 in Berlin. More than 106,000 visitors from 110 countries, not including the general public during the weekend opening after the fair, had the opportunity to preview 2,400 exhibi-tors’ products, some of which were based on small form factor modules designed for control electronics.

For more information, contact Hermann at [email protected].

Figure 1 | Manufacturing Wanzl’s shopping carts and other products requires electronic control systems to manage the welding equipment used for connecting the steel wire nettings.

Figure 2 | The Speedway-767 small form factor controller module from WAGO provides uplink communication via Ethernet or fieldbus.

RAF Male-Female Stacking SpacersRAF Male-Female Stacking Spacers

Use these precision-made components to build structurally secure standalone stacks.

Compatible with more than 100 different PC/104 ultra-compact bus board modules.

www.rafhdwe.com


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Interoperability is the ability of a system or a product to work with other systems or products. Major well-known programs,

from weapon systems to Microsoft’s IT initiatives, have been conducted to deliver innovative solutions in mixed environ-ments. The same logic applies to the designer using Small Form Factor (SFF) boards, as interoperability builds customer choice, drives developer innovation, and grows industry opportunity.

The main way to achieve interoperability in SFF designs is by adhering to and building upon industry standards. For SFF-based designs, this applies to board size, CPU and I/O architecture, software compatibility, connectorization, and packaging. Each has a significant element to play.

Interoperability is required at multiple levels to allow different manufacturers’ products to work with each other. One key question designers need to address is: At what level of definition and inte-gration should standards be defined and implemented? This is a difficult question because it involves balancing the conflict-ing issues of including too much versus too little specification detail. However, answering the detail question is essential when considering a standard’s impact on SFF boards.

Consolidating I/O ecosystemsThe SFF-SIG took up this challenge as it set out to define stackable solutions for next-generation embedded systems. The SFF-SIG’s charter is devoted to identify-ing, creating, and promoting standards that

help companies utilize SFF technologies in their products to protect their invest-ments over the long term. With a focus on ultra-low-power and mobile processors including the Intel Atom and VIA Nano processor families, the SIG aims to blend high-speed PCI Express and USB serial buses with Serial Peripheral Interface (SPI), Low Pin Count (LPC), and SMBus (I2C) buses in a compact, cost-effective manner.

It took the SFF-SIG four months to define Stackable Unified Modular Interconnect Technology (SUMIT), a form factor- and processor-independent connector stan-dard. SUMIT connectors take up a very small amount of space on SBCs or I/O cards yet support tremendous processing power. Unifying the expansion interfaces

Achieving compatibility by standardizing SFF designs By Robert A. Burckle

Without standards, chaos would result when implementing module-level designs in ways that best fit each particular application. Modules would be incompatible with other manufacturers’ products and perhaps even with engineers’ own previous designs. Basing designs on industry standards such as SFF-SIG’s specifications provides interconnection with a variety of boards and support for current and future I/O technologies.


THE BIG YET SMALL PICTURE Mission interoperable

on SBC form factors has the potential to consolidate I/O ecosystems, whichimproves economies of scale for I/O (see Figure 1).

SUMIT is an electromechanical connec-torization specification using two 52-pin high-density (0.025" pitch) connectors with center ground blades for impedance, EMI, and DC ground return purposes. Each connector is optional depending on the target applications of a particular SBC. The SUMIT Type A connector con-tains one PCI Express x1 lane, four USB ports with a global overcurrent signal, LPC bus for expansion serial ports and other legacy I/O, SPI/Microwire, and a general-purpose I2C bus typically con-nected to SMBus for x86 chipsets. The multitude of low-speed buses available on SUMIT enables a smooth transition away from the long-standing ISA bus, which most of the embedded market uses for tasks like switching on relays or low-rate data acquisition.

The SUMIT Type B connector adds another PCI Express x1 lane and a x4 lane, primarily for storage/RAID, net-working, video output or frame grabbers, high-speed acquisition, and scientific applications. There are three configura-tions defined as SUMIT A, SUMIT B, and for both connectors, SUMIT AB. Form factor details are distinct from the SUMIT connector and pinout details, and are therefore left to those respective specifications. This allows the smaller SUMIT-enabled interconnect solution to be used on a variety of boards, from 60 mm x 72 mm Pico-I/O modules to 5.75" x 8.0" EBX-sized boards.

SUMIT maps well to the new single-chip chipsets for sub 10 W designs and closely follows the trend of replacing parallel interfaces with high-speed serial interfaces. Another stackable expansion interface that was defined by a different organization was principally for three-chip x86 solutions, but it doesn’t scale down to the low cost, space, and power needed in today’s two-chip x86 plat-forms. PCI Express is replacing parallel PCI, Serial ATA is replacing Parallel ATA (PATA, or IDE), and GbE and USB 2.0 are gradually replacing serial ports and other cabled board-to-board or board-to-peripheral interfaces. SUMIT supports the legacy peripherals that are still pervasive in many applications by allowing external LPC-to-ISA bridges plus LPC UART and

Figure 1 | SUMIT supports standard expansion buses on a stackable connector.

SUMIT A Connector SUMIT B Connector

Contains ContainsPCI Express x1: One

USB 2.0: FourLPC (Low Pin Count) Bus

SPI/Microwire PowerSMBus/I2C Bus Ground

ExpressCard Control Signals

PCI Express x1 & x4or

PCI Express x1: Five

2 2 5252

1 51 1 51


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super I/O devices, with legacy interrupt support provided through the essentialSERIRQ serial interrupt signal.

Maintaining legacy supportInteroperability among different form factor SBCs and stackable I/O cards took a leap forward with the introduction of SUMIT as a low-risk, small-footprint, and high-performance next-generation system interconnect. But to be used in a meaningful way, the SUMIT connector had to be integrated onto several different board sizes. One problem the SFF-SIG identified was PC/104 boards’ incom-patibility with other proposed stackable PCI Express solutions. Therefore, the SFF-SIG defined an Industry Standard Module (ISM) and ISM with SUMIT to fill this void.

The 90 mm x 96 mm board size has become an industry standard; however, there are multiple variations with con-nectors located in different parts of the board. Separating connector issues from the expansion board form factor lets a designer choose a different connector and place it where it’s most appropriate on the board. By sticking to the 90 mm x 96 mm “PC/104” form factor and mount-ing holes, a system can be upgraded

using the same form factor and usually the same enclosure.

The ISM Specification provides an explicit form-factor-only definition upon which the SUMIT-ISM Specification is built. Because the SUMIT Specification defines only a board-to-board interface (connectors and pin definition), the ISM Specification is necessary to define the form factor while the SUMIT-ISM Specification defines how SUMIT is implemented on ISM.

To support a variety of legacy 90 mm x 96 mm modules marketed as PC/104 or PCI-104 on a SUMIT-ISM stack, the SUMIT-ISM Specification offers design flexibility while it maintains compat-ibility. The SUMIT-ISM Specification defines two legacy stack types using slot-ted mounting holes on ISM to provide symmetry not found with PC/104. SUMIT-ISM can thus be created with legacy support for either the PC/104 ISA bus or the PCI-104 PCI bus by allowing the module to be rotated 180 degrees as neces-sary to fit the legacy type required while maintaining the SUMIT interface. Legacy bus support can be supplied by the CPU and maintained up the stack or provided through a bridge module in the stack.

The main reason the SFF-SIG defined SUMIT-ISM was to continue module interoperability by supporting existing customers who have designed or pur-chased PC/104 modules for years. Roughly 50-80 percent of existing customer stacks include PC/104 (ISA) bus cards. If de-signers are using the original PC/104 bus modules, they don’t want additional stack height or software changes for existing I/O cards from third-party vendors or the customers themselves. SUMIT-ISM allows them to preserve the size envelope but doesn’t tie them down to the older I/O expansion. Furthermore, SUMIT-ISM is future-proof, as it includes only standard x86 buses and interfaces that are included in x86 chipset vendors’ current offerings and roadmaps for years to come.

Many companies have added SUMIT connectors on EPIC and EBX SBCs for stackable I/O. The SFF-SIG has also defined a new, smaller SUMIT-enabled I/O module called Pico-I/O, which is half the size of a 90 mm x 96 mm board (see Figure 2).

Stackable I/O for the next generationDesigners requiring future-proofing capa-bility for embedded systems with inter-operable, stackable I/O and leading-edge technology such as PCI Express can use SUMIT to work seamlessly with different next-generation mobile and low-power processors. SUMIT’s standardization enables interoperability in a multi-vendor, multi-board, multi-form-factor envi-ronment, which explains why so many new products conform to this standard. For more information on the SUMIT and SUMIT-ISM Specifications, visit www.sff-sig.org/sumit.html. ➤

Robert A. Burckle is VP of WinSystems.He has 30-plus years of experience in embedded computing and earned both Bachelor’s and Master’s degrees

in Electrical Engineering from the University of Louisville plus an MBA from the University of North Texas.

WinSystems817-274-7553

[email protected] Figure 2 | SUMIT connectors on an EBX-sized board offer mounting hole patterns for both

Pico-I/O and SUMIT-ISM.



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www.rtd.comRTD Embedded Technologies, Inc.

103 Innovation Boulevard • State College, Pennsylvania • 16803 • U.S.A.Phone: 814-234-8087 • Fax: 814-234-5218 • www.rtd.com • [email protected]

dspModules™Coprocessors & Accelerators•

Specialty I/OPulse Width Modulator•Incremental Encoder•Opto-Isolated MOSFET•

Frame GrabbersSingle or Multi-channel•MPEG-2 Compression•

Video ControllersAnalog VGA•TTL and DVI panels•

Communication ModulesExpress Dual 1G Ethernet•5-Port Ethernet Switch•Copper or Fiber Ethernet•USB 2.0 and FireWire• TM CAN Bus & CAN Spider•Dual Synchronous Serial•Octal PCI Serial•

Wireless TelematicsGSM & GSM-R•EDGE, GPRS, SMS•GPS & Wi-Fi•

Motion ControllersDC Motor Controllers•Synchro, Resolver, LVDT•

Mass Storage1.8/2.5” IDE & PCMCIA•CompactFlash•

Bridge ModulesexpressMate• TM

PCIe to PCI•PCI to ISA•

Power SuppliesPC/104 & PC/104-• PlusPCI/104-Express• TM Family50/75/83/88/100 Watts•ATX Power Supplies•UPS Backup•MIL-STD-704/461 •

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A Founder of the PC/104 ConsortiumAS9100 and ISO 9001 Certified

RTD Embedded Technologies, Inc.An AS9100 and ISO 9001 Certified Company

IDAN® and IDANplusTM

Retrieve sensitive data using the PCIe/104 Type 2 SATA interface. The hot-swappable drive drawer accommodates 2.5" drives. Accelerated conduction

cooling with advanced heat pipes and fins

Removable IDAN SATA Drive

MIL-STD-704/461 •

plusTM

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CPU Max Clock Rate (MHz) 1860 1200 1400 1400 1400 1400 1400 1400 650 650 650 650 500 500

Intel SpeedStep Technology ACPI Power Management 3.0 3.0 2.0 2.0 2.0 2.0 2.0 2.0 1.0 1.0 1.0 1.0 2.0 2.0

Max Onboard DRAM (MB) 2GB 2GB 512 1GB 512 1GB 1GB 1GB 512 512 512 512 512 512

RTD Enhanced Flash BIOS Nonvolatile Configuration

RTD Quick Boot USB Legacy (Keyboard & Boot)

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Watchdog Timer Solid State Hard Drive Disk Chip 8GB 8GB 8GB 8GB 8GB 8GB 8GB 8GB 8GB 8GB 8GB 8GB 8GB 8GB

Audio HD HD Analog Video SVGA SVGA SVGA SVGA SVGA SVGA SVGA SVGA SVGA SVGA SVGA SVGA SVGA SVGA

Digital Video LVDS LVDS LVDS LVDS LVDS LVDS LVDS LVDS TTL LVDS LVDS

PS2 Mouse/Keyboard/Utility Port USB Mouse/Keyboard

I/O

RS-232/422/485 Ports 4 4 4 4 4 2 4 2 2 2 2 2 2 2

SATA 2 2

USB 2.0 6 6 4 2 2 4 2 4 2 2 2 2 2 2

Gigabit Ethernet 1 1

10/100Base-T Ethernet 1 1 1 1 1 1 1 1 1 1 2 1

Parallel Port

aDIO (Advanced Digital I/O) 14 14 14 18 18 18 36 36 18 18 18 18 18 18

aAIO (12-bit Advanced Analog I/O) 8 8

multiPort (aDIO, ECP, FDC)

SW ROM-DOS Installed

DOS, Windows, Linux

visit www.rtd.com for complete product listingECC Memory available on Pentium M. Core 2 Duo with HD Audio or aAIO options.

-40 to +85°C

Intel® CoreTM 2 Duo 1.86 GHz Intel® Pentium® M 1.4 GHz AMD GeodeTM LX 500 MHz

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Single-Ended Inputs 16 16 16 32 16 16

Differential Inputs 8 8 8 16 8 8

Max Throughput (KHz) 1250 1250 500 100 1250

Resolution (bits) 12 12 12 12 16 12

Input Ranges/Gains 3/7 3/7 3/4 3/4 1/4 3/6

Autonomous Calibration

Data Marker Inputs 3 3 3 3

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log

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Analog Outputs 2 2 2 4 2 2

Max Throughput (KHz) 200 200 200 200 100 200

Resolution (bits) 12 12 12 12 16 12

Output Ranges 4 4 3 3 1 4

D/A FIFO Buffer 8K 8K 8K

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Channel-Gain Table 1K 1K 1K 1K 1K 1K

Scan/Burst/Multi-Burst A/D FIFO Buffer 8K 8K 8K 8K 8K 8K

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Total Digital I/O 16 16 16 16 16 16 48 18/9 64 48 48 48 48

Bit Programmable I/O 8 8 8 8 8 8 24 6/0 48 48 48 †

Input FIFO Buffer 8K 8K 8K 8K 8K 8K

Opto-Isolated Inputs 48

Opto-Isolated Outputs 16

User Timer/Counters 3 3 2 2 2 3 3 3 10 10 10 6

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Advanced Interrupts 2 2 2 2 2 2 2 2 2 2 †

Versatile Memory Buffer 4M 4M 4M 8MB

External Trigger †

Incr. Encoders/PWMs 3/9 4/8 4/8 4/8 †

† User-defined, realizable in FPGA

-40 to +85°C

visit www.rtd.com for complete product listing

IDAN® — Intelligent Data Acquisition NodeRugged PC/104 stackable framed modules•Quick interchangeability and expansion•Structural heat sinks, cooling fins & heat pipes•Milled aluminum frames •Standard PC connectors•Optional MIL-SPEC paint & shock mounts•

HiDAN® SystemsRugged, watertight enclosure•Integrated tongue & groove O-ring •Environmental sealing & EMI suppression•Structural heat sinks & heat pipes•Milled aluminum frames with opt. heat fins•MIL cylindrical I/O connectors•MIL-SPEC paint & shock-mounts optional•

“MIL Value for COTS prices”TM

HiDANplusTM

HiDANplusTM SystemsHiDAN with IDAN modularity•Stackable signal raceway•

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Conduction-cooled, Hybrid RF/Embedded System

VHF/UHF receiver•Multi-band synthesizer•FPGA Coprocessor•High-end GPS receiver•Pentium M cpuModule•Isolated Power Supply•

† User-defined, realizable in FPGA

— Intelligent Data Acquisition Node

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HiDAN••

HiDANplusTM

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Conduction-cooled, Hybrid

PCIe/104 cpuModule™ featuring Intel® CoreTM 2 Duo processor, with eight PCIe x1 links, one PCIe x16

link, 8 analog inputs, 2 SATA, LPC, 6 USB 2.0 and Dual Ethernet. Shown here with Analog

dataModule® and ATX Power Supply

TI 8000 MIPS dspModuleTMData Acquisition Wireless Telematics

“Accessing the Analog World”

HighRel PC/104 ISA, PCI & PCIe Modules and SystemsHighRel PC/104 ISA, PCI & PCIe Modules and Systems-40 to +85°C

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Any embedded system can be described as an algorithmic black box con-nected to inputs and outputs. In most

embedded applications, the inputs consist of digital bits, frequencies, voltages, cur-rents, and similar familiar signals, while the outputs include more digital bits, fre-quencies, voltages, and currents. More complex embedded devices incorporate RS-422, Ethernet, or NTSC or HDMI connections.

Inside this conceptual black box, the algo-rithms align to monitor and control the inputs and outputs. All of this algorithmic functionality can be labeled as “software” and set aside. Whether implemented in VHDL, microcode, C, or Java, firmware or software, the algorithms that perform the device’s functionality are capable of run-ning on any available hardware platform.

Before a design can exist, designers must define the inputs and outputs, addressing

several questions. Consider the example of a vending machine design. How many buttons will it have? Each button will have associated digital signals. How many vending motors will it need? Each motor needs frequency, voltage, current, and/or pulse-width modulation control outputs. Does it need to be networked for logis-tics? That would point at POTS or perhaps TCP/UDP. How many blinkenlights will it have?

The answers to these questions are more product-defining than the decisions about which language or processor the device should run – more critical than what is inside the black box. No matter which inputs and outputs are involved, the embed-ded device design is defined by them.

Consistency throughout the design cycleMany companies make prototypes using arbitrary hardware and software with no

expectation that they might relate to the production unit. These early builds are usually designed on shoestring budgets to get a feel for the system or to sell the idea to management.

Leveraging these expenses into future stages of the production cycle can be costly. However, by integrating interop-erable I/O modules, designers can keep using the same modules throughout production and circumvent the need to rewrite code for a new input device (or vendor) while moving through the design cycle.

At each phase in the process, device designs must conform to smaller, lower-power, quieter, cooler, and/or cheaper footprints. Interoperable I/O modules can enable the device to continue work-ing with each iteration of the black box, regardless of the architecture. Instead of running on a desktop full-size PC, the

When designing an embedded device, designers should consider the I/O requirements first. Implementing COTS components to assemble proof-of-concept prototypes saves money and time. By using a full-size PC and USB data acquisition modules, designers can prove the functionality of a device and avoid most if not all engineering expenses.

Outside the black box: Focusing designs on I/O By John Hentges



device can be powered by Mini-ITX, Computer-on-Module (COM), Pico-ITXe, or a full custom backplane using the exact same plug-in data acquisition modules.

USB helps ensure longevityUSB is the key to achieving this interop-erability. At any scale of custom or COTS design, from desktop PCs purchased online to solid-state fanless Pico-ITXe systems measuring less than 100 mm on one side, USB is present. Every modern interconnect architecture includes USB interfaces. Stackable Unified Modular Interconnect Technology (SUMIT), EPIC, Pico-I/O, ETX, and other standard form factors all include at least one and usually four or more USB ports. Each port can be expanded with off-the-shelf hubs – boxes or chips – to get more than 100 USB devices in a system, per USB controller.

Choosing I/O on USB eliminates the hassle of making changes to the data acquisition module as designers iterate closer to production designs. Use any desktop PC with USB data acquisition modules in the proof-of-concept (Figure 1), then build the engineering prototype using Mini-ITX or ETX, and wrap up the pro-duction unit design with Pico-ITXe or a SUMIT – Industry Standard Module (ISM) system – each and every choice will have USB available. Even the IP for FPGA or ASIC full custom designs is readily available. Later on, three or five

years down the road when the algorithmic black box isn’t available anymore, USB will still be there for the product’s I/O.

One concern worth noting is that USB interconnects vary among embedded platforms, especially when compared to desktop PCs. An ordinary desktop uses USB A connectors to host its USB bus. PC/104, EPIC, ETX, and other “medium”-sized form factors offer a variety of possi-ble connection methods. In some designs, a full USB A is provided. Others only have a 5-pin micro header requiring a

1.800.548.2319 www.wdlsystems.com [email protected] www.wdlsystems.com [email protected] Embedded Products SourceThe Embedded Products Source

P104-WDG-CSM

VDX-6354

Temperature measurement,monitor,and alarm

Software selectable timeout from 4 µsec

Watchdog open collector reset outputs

Fan status and speed control

Two general purpose 8-bit A/D inputs

Light sensor for enclosure security

Extended temperature (-40C ~ +85C) available

DM&P SoC CPU Vortex86DX- 800MHz

PC/104 compliant, PCI-104 & PC/104+ (Optional)

XGI Volari Z9s Chipset, 32MB VGA Memory

Integrated 10/100Mbps Ethernet

Watchdog Timer, software programmable

256/512MB DDR2 onboard

Extended Temperature (-40C ~ +85C)

Figure 1 | Designers can use a desktop PC with USB data acquisition modules in a proof-of-concept design.

“At any scale of

custom or COTS design,

from desktop PCs

purchased online to

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Pico-ITXe systems

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cable kit or some other adapter to remain compatible with the off-the-shelf USB I/O selected during the prototyping phase.

This is also a concern as designers prog-ress to the final designs. SUMIT-ISM, Pico-ITXe, and other smaller form factors only provide their USB bus on the embed-ded (often SUMIT) connector, without offering a cable connection. During the development process, designers can add an adapter to break out these signals, but the long-term solution is to integrate the USB I/O device onto a SUMIT-ISM, Pico-I/O, or similar module. This is simply a layout concern. No real engineering is neces-sary, as the device retains the same USB bus architecture. Changing the physical layout of the I/O device has little or no impact on its schematic when USB is kept at its heart.

In fact, SUMIT and other connectors used in many embedded platforms allow more than one USB device to be added easily using modern lane-shifting techniques that eliminate setup and configuration headaches.

More cost-effective production runsUsing a PC in a production device can simplify prototyping, particularly when

integrating a ubiquitous bus like USB that allows the same I/O devices and the same development effort to be used while pro-ceeding toward production designs.

As production quantities get larger, a full custom solution becomes more appealing; however, engineering costs are very high, so the cost-per-unit versus non-recurring engineering expense must be weighed against production volume. Historically, the break-even point for full custom solutions is measured in hundreds of thousands of pieces.

ETX and other COM systems have lowered that barrier and proven to be cost-effective for production runs measured in mere thousands. By using USB and other interoperable bus I/O modules, design-ers can squeeze that break-even point down to product runs measured in the hundreds. The right vendor can take the existing schematics for one or more USB data acquisition I/O devices and integrate them onto a single ETX baseboard for far less time and money than any new design can be engineered.

This means designers can build a proof-of-concept using one or more USB or USB/104 data acquisition devices and continue using the same modules while

shrinking the black box smaller and smaller (see example in Figure 2). Then, if necessary, those same modules’ underly-ing designs can be slapped onto a custom ETX baseboard or SUMIT-ISM module, and the software will work the same way it did in the original prototypes.

As the long-term intended level of integration gets deeper, the form factors of the I/O modules used in the original prototyping phases matter less and less, while the need to choose an interoperable technology such as USB remains. How-ever, if a design will not be integrated beyond a multiboard level, it is impor-tant to choose CPU and baseboard form factors that will be available for the long haul – industry-standard, modular, and vendor-neutral specifications like ETX and other COM systems, SUMIT-ISM, and Pico-ITXe (Figure 3). This ensures that designers will be able to fill the black box for years to come.

If quantities justify building a fully inte-grated PCB, the underlying designs should be available for that situation as well. This reduces engineering expenses because instead of designing in-house, designers can simply integrate vendor IP directly into their system. Using a bus like USB means the software doesn’t need to change.

Open source provides code visibilityTo further ensure interoperability, design-ers should select vendors that embrace open source. USB is a multilayered protocol stack, from the bare serial port interface at its heart to the packetization specification all the way up to high-level APIs from the I/O vendor. When iterating a design to the production-ready stage, it might be useful to eliminate layers in the protocol stack. An I/O module that documents each of these layers of com-munication provides the requisite infor-mation should this become necessary.

Open source designs also enable sup-port for the I/O device in environments both new and old. Does the I/O device support development in COBOL? What about Haskell? Even if the environment the application requires is too old, too exotic, or too new to be supported by the vendor directly, having the source code available to every layer of the Figure 2 | A 1U rack chassis design uses a PCI-104 CPU and seven USB/104 I/O boards.



software stack ensures that interoperabil-ity is achievable.

Thus, designers can benefit from using USB data acquisition modules like those offered by ACCES I/O Products that pro-vide a high-level API for OS X, Linux, and Windows, as well as document all vendor-specific USB Control Requests. These modules supply full source code

for every layer of driver, dynamic link library, shared object, sample program, and utility. Some vendors including ACCES I/O Products also provide on-card firmware source code in the cross-platform C language.

The best bus choiceAlthough this article focuses on USB, much of the discussion to some extent applies to other communication chan-nels on modern module interconnects. SUMIT and other connector specifi-cations include PCI Express and LPC channels in addition to USB. However, despite the possibility of using these other buses across the same connectors, true vendor neutrality and interoper-ability are currently best achieved by sticking with USB when latency and throughput match the application requirements. For example, the LPC bus, although included, does not have a software layer defined – there is no register map standard, no base address,

no protocol for accessing LPC lanes – between vendors.

USB is thus the simplest and most inter-operable choice for vendor neutrality, compatibility, and flexibility throughout the design cycle. ➤

John Hentges is head of design and customer service for ACCES I/O Products. His experience includes 21 years at ACCES I/O Products and directing

data acquisition software projects for companies such as Duracell, Harris, Lawrence Livermore National Laboratory, Honeywell, and the X PRIZE Foundation.

ACCES I/O Products858-550-9559

[email protected] www.accesio.com

Figure 3 | To help ensure longevity, designers should choose standard form factors like Pico-ITXe, shown here with ACCES Pico-I/O stacking modules using SUMIT.

Value only an Industry Leader can provide.Selec ng a complete, dedicated pla orm from Logic Supply is simple: Pre-con guredsystems perfect for both business & desktop use, OS development services for greater system customiza on, and a wealth of online resources all within a few clicks.

Extreme Environment Solutions Designed for Your Application

Learn More > www.logicsupply.com/embedded

Low-Pro le Intel® Atom™ Control BoxFanless with -40°C–70°C opera ng temperature range.Incredibly compact and full featured; no compromises.

High-End Intel® Core™2 Duo with PCI ExpansionFanless opera on; withstands -40°C–70°C temperature range.Wide range of I/O makes for a powerful, mul media pla orm.

© 2010 Logic Supply, Inc. All products and company names listed are trademarks or trade names of their respective companies.

PC/104 and Small Form Factors2011 BUYER’S GUIDE 3.

5-in

ch |

CO

M E

xpre

ss

3.5-

inch

COM

Exp

ress


Buyer’s Guide Index3.5-inchAdvanced Digital Logic (ADL) . . . . . . . . . . . . . . .20Avalue Technology Inc. . . . . . . . . . . . . . . . . . . . .20

COM ExpressADLINK Technology, Inc. . . . . . . . . . . . . . . . . . . .20Avalue Technology Inc. . . . . . . . . . . . . . . . . . . . .20Eurotech . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20LiPPERT Embedded Computers . . . . . . . . . . . . . .20Pinnacle Data Systems, Inc. . . . . . . . . . . . . . . . .21

COM/SOMSponsored by Eurotech EMAC, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21Eurotech . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21Technologic Systems . . . . . . . . . . . . . . . . . . . . . .21

Industrial automationKontron . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21Logic Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21

Mini-ITXWDL Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21

Packaging and power suppliesRAF Electronic Hardware . . . . . . . . . . . . . . . . . . .22Tri-M Technologies Inc. . . . . . . . . . . . . . . . . . . . .22

PC/104Advantech Corporation . . . . . . . . . . . . . . . . . . . . .22Kontron . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22WinSystems, Inc. . . . . . . . . . . . . . . . . . . . . . . . . .22

PC/104-PlusAdvanced Digital Logic (ADL) . . . . . . . . . . . . . . .22Avionics Interface Technologies . . . . . . . . . . . . .22

Tri-M Technologies Inc. . . . . . . . . . . . . . . . . . . . .23VersaLogic Corp. . . . . . . . . . . . . . . . . . . . . . . . . . .23

PCI/104-ExpressSponsored by Connect Tech Inc. Advanced Digital Logic (ADL) . . . . . . . . . . . . . . .23Connect Tech Inc. . . . . . . . . . . . . . . . . . . . . . . . . .23RTD Embedded Technologies, Inc. . . . . . . . . . .23

Pico-I/OACCES I/O Products, Inc. . . . . . . . . . . . . . . . . . . .23

Rugged/Mil-SpecAcromag . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24Eurotech . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24Excalibur Systems, Inc. . . . . . . . . . . . . . . . . . . . .24

SUMITDiamond Systems Corporation . . . . . . . . . . . . . .24

Based on the Intel Core 2 Duo/Celeron M Small Form Factor (SFF) processors and the Intel GS45 Express (Cantiga) chipset • Up to 8GB DDR3-1066MHz DRAM • 2x 10/100/1000Mbit LAN controllers • 2x DVI/HDMI • 2x SATA 3Gb/s with RAID 0/1 support • 8x USB 2.0 ports • 4x RS-232/TTL ports • 6-channel High Defi nition Audio • RTC and watchdog timer • Integrated Trusted Platform Module (ITPM) • PCI Express bus (four x1 or one x4) via 2x40-pin custom connector • IDE interface • mPCI connector • Serving the PC/104 industry for over 15 years

Advanced Digital Logic (ADL) ADLGS45HD

www.adl-usa.com smallformfactors.com/p46617

Intel® Atom™ E620/640/660/680 Series 3.5" Micro Module with Intel® Platform Controller Hub EG20TFeatures & Benefi ts:• Intel® Atom™ Processor E620/640/660/680 Series • Intel® Platform Controller Hub EG20T• Onboard DDR2 1GB Memory • 5.1-CH Audio, Dual Intel® Gigabit Ethernet • 2 x SATA, 3 x RS-232,1 x RS-422, 1 x RS-485, 1 x CANbus • 4 x USB, 16-bit GPIO • 1 x Micro SD, 1 x CF socket• 1 PCIe Mini Card slot • Wide temperature tolerance

Avalue Technology Inc. ECM-QB

www.avalue.com.tw or [email protected] smallformfactors.com/p46624

Extreme Rugged COM Express Type 2 Computer-On-Module (COM) • Combines the latest high-performance Intel Core i7 processor running at up to 2.0 GHz with the advanced Mobile Intel QM57 Express chipset • Applications include the aerospace, military, defense, transportation, and gaming industries • Operation over a wide power supply range from 9 V to 16 V and over an extended temperature range of -40 °C to +85 °C • Extensible Firmware Interface (EFI) for a highly reliable, versatile, and adaptable BIOS layer • Supports up to 8 GB of DDR3 memory and provides onboard I/O interfaces for GbE, eight USB 2.0 ports, four SATA ports, and an IDE (PATA) channel • Legacy support provided for PCI, LPC, SMBus, and I2C

ADLINK Technology, Inc. Express-CBR

www.adlinktech.com smallformfactors.com/p44189

Intel® Core™ i7/Core™ i5/Celeron® COM Express Module with Intel® QM57 ChipsetFeatures & Benefi ts:• Supports Intel® Core™ i7 620LE/620UE/Celeron® P4505 CPU • Intel® QM57 Chipset • Two 204-pin SODIMM sockets up to 8GB DDR3 800/1066 SDRAM • Dual-view, dual-channel 18/24-bit LVDS• Intel® High Defi nition Audio • Intel® 82574L Gigabit Ethernet • 4 SATA, 8 USB 2.0• LPC, 4 PCI, 6 PCIe x1, 1 PCIe x16, SDVO (optional) • Supports RAID 0/1/5/10 • TPM

Avalue Technology Inc. ESM-QM57

www.avalue.com.tw or [email protected] smallformfactors.com/p46625

The Adbc8031 from Eurotech provides the graphics and performance capabilities of the Intel® Core i5/i7™ processor in a low-power COM Express standard. This module is ideal for applications such as automotive, controls, gaming, digital signage, and more. The Adbc8031 makes it possible to run multiple processes concurrently for extensive data-crunching capabilities while maintaining a low power specifi cation. In addition, the Adbc8031 is the perfect choice for devices where security and reliability are critical. It is equipped with an Advanced Encryption Standard (AES) engine and has Error Correction Code (ECC), which helps to detect and correct errors in memory transactions in sensitive applications.

Eurotech Adbc8031 – COM Express with Core i5/i7

www.eurotech.com smallformfactors.com/p46620

The COM Express compact module features an Intel® Atom™ E6xxT with max. 2 GB soldered DDR2 RAM. Onboard are SDVO and LVDS interfaces, SATA, PATA, 5 PCIe x1, 7 USB 2.0 ports, Gigabit LAN, and a µSD card slot. CANbus and 4 UART ports on lockable option connectors require external transceivers.The Toucan-TC offers a fail-safe BIOS, optional SSD (up to 64 GB), a µSD card slot, and comprehensive condition monitoring (LEMT), which provides numerous additional software functions.The Toucan-TC is optionally available for extended temperatures from -40 °C to +85 °C.

LiPPERT Embedded Computers Toucan-TC

www.lippertembedded.com smallformfactors.com/p46621

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The SoM-9G45/9M10 is a System-On-Module (SOM) based on either the Atmel ARM9 AT91SAM9G45 or AT91SAM9M10 processor. This fanless ARM9, 400 MHz SOM has an Ethernet PHY included along with 4 serial ports. It utilizes up to 256MB of external DDR2/SDRAM and 1GB of NAND Flash and includes an MMU, which allows it to run Linux and Windows CE Operating Systems. The SoM-9G45/9M10 is the ideal processor engine for your next design. All of the ARM processor core is included on this tiny board, including: Flash, memory, serial ports, Ethernet, I2S audio, PWMs, timer/counters, A/D, digital I/O lines, video, clock/calendar, and more. For more info visit: www.emacinc.com/som/som9g45.htm.

EMAC, Inc. SoM-9G45/9M10

www.emacinc.com smallformfactors.com/p44298

COM/SOM

PDSi’s AMD Socket S1 COM Express Module (COMX-S1) is a low cost, compact, embeddable computing core with the capability to drive a broad range of OEM applications. Built around AMD’s x86-based Socket S1 processors, it enables 64-bit computing at a progression of performance levels from the ultra low-power AMD Sempron™ 2100+ (perfect for fanless applications) to the dual-core muscle of the AMD Turion™ X2 TL62. The Computer-on-Module design is fully compliant with PICMG COM Express Type 2 specifi cations, offering a large variety of interfaces to cover the needs of most embedded applications.

Pinnacle Data Systems, Inc. AMD Socket S1 COM Express Module

www.pinnacle.com – [email protected] smallformfactors.com/p44294

TS-SOCKET Macrocontrollers are CPU core modules that securely connect to a baseboard using the TS-SOCKET connector standard. COTS baseboards are available, or design your own baseboard for a custom solution with drastically reduced design time and complexity. Start your embedded system around a TS-SOCKET Macrocontroller to reduce your overall project risk and accelerate time to market. Models include: TS-4200 Atmel ARM9 with super low power • TS-4300 Cavium ARM11 with dual 600 MHz and FPU • TS-4500 Cavium ARM9 at very low cost • TS-4700 Marvell PXA168 with video and 1.2 GHz CPU • TS-4800 Freescale iMX515 with video and 800 MHz CPU.

Technologic Systems TS-SOCKET Macrocontrollers

www.embeddedARM.com smallformfactors.com/p44297

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Eurotech’s Catalyst LP delivers the latest Intel® Atom™ N450 and D510 processorsin a small 67 x 100 mm form factor. The Intel Atom processors are available with both single-core (N450) and dual-core (D510) capabilities, a 400MHz graphics engine, and 667MHz DDR2 memory. The Intel® ICH8M companion chip brings out high-speed I/Osuch as Gigabit Ethernet and USB 2.0.

With so much capability and performance, Catalyst LP is suited for a range of target applications such as industrial automation, HMI, medical, and other markets. It offers sophisticated graphics for applications requiring high-end 2-D and 3-D visualization with high-resolution graphics capabilities. In addition, high-bandwidth I/O capability including PCIe and data storage interfaces like SATA make data retrieval and processing easy and reliable. All of this power is built into the small, fanless design at under 7W of power consumption, which means the Catalyst LP can be tailored for battery-operated handheld devices.

Eurotech Catalyst LP


Kontron’s smallest Box PC using PC/104 technology is confi gurable to your needs. Passive cooling with LX800-500MHz processing. 3x USB, up to 4x RS-232, LPT, opt. 2x CAN, XVGA, stereo sound, 2x LAN 100Mb/s, 256MB (max.1GB), CF with Linux, opt. 2.5" HD with 160GB, power supply: 8V-28VDC, 165 x 110 x 27mm, Boot-CF with DOS, Linux.

Kontron Kontron MICROSPACE™ 2X Family of Box PCs

www.kontron.com smallformfactors.com/p46616

Industrial automation

The Extreme Environment PT-9WC1 takes high-performance computing to a whole new level. Touting a2.26 GHz Intel Core 2 Duo processor in a ruggedized, fanless enclosure, it has the ability to withstand extended temperatures of -40 °C ~ 70 °C and is resilient to shock and vibration, making it a fl exible computing platform. It features dual Gb LAN, up to four RS-232 COM support, DVI-D (can be switched out to either a Digital I/O or Parallel port with included cable), VGA, DisplayPort, and watchdog timer.The PT-9WC1 is excellent for use in harsh industrial environments.

Logic Supply PT-9WC1

www.logicsupply.com smallformfactors.com/p46613

Industrial automation

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WDL Systems distributes the latest technology to provide customers with Commercial Off-The-Shelf (COTS) products for all embedded requirements • Mini-ITX embedded motherboards are easily cooled, highly versatile main boards featuring low-power processors, onboard LAN, various integratedAGP graphics, audio options, slots, and connectors

WDL Systems Mini-ITX Boards

www.wdlsystems.com smallformfactors.com/p39216

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Male-Female Stacking Spacers help overcome space limitations when PC/104 or PC/104-Plus bus drives are installed. With this approach, stand-alone module stacks are used like ultra-compact bus boards, but without needing backplanes or bird cages. Module boards are spaced exactly 0.6 inches apart using RAF precision-made nylon or aluminum spacers to build structurally secure stand-alone stacks. RAF spacers allow embedded system designers to employ application-specifi c module stacks for their products that are easily and securely assembled. The RAF hardware can be used with more than 100 different modules produced by manufacturers today.

RAF Electronic Hardware Male-Female Stacking Spacers

www.rafhdwe.com smallformfactors.com/p30218

Packaging

The HPSC104-SER is a 160W PC/104 DC-DC converter that includes a fl ash-based microcontroller and4A charger for advanced power management and smart battery charging from 10V to 35V. It provides up to four stages of battery charging and can charge SLA, NiCd, NiMh, and level two and three SMBus compatible batteries. The HPSC104-SER allows timed on/off control, notifi cation of changes to main power or battery status, and monitoring of up to 16 temperatures using I²C digital temp sensors. It is available with RoHS compliance and has a standard operating temperature of -40 °C to +85 °C.

Tri-M Technologies Inc. HPSC104-SER

www.tri-m.com smallformfactors.com/p46628

Packaging

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Kontron’s family of 3.5-inch PC/104 compatible SBCs delivers scalable performance and power consumption. From the power-effi cient JREXplus-DC to the high-performance JREXplus-690, there is an off-the-shelf option for a wide array of applications. Application developers have access to all of the onboard features of the JREXplus SBCs including USB, COM, 2x LAN, 2x SATA II, and more. Plus, these SFF SBCs can be integrated with a variety of PCI-104 I/O expansion cards. Whether it’s a control core for an industrial PC or a solution capable of intense graphics, Kontron JREXplus SBCs can help you achieve your application goals and get to market quickly.

Kontron Kontron Embedded PC/104 compatible SBCs


PC/104

The demands placed on appliances used in the fi eld range from extreme temperature exposure to constant vibration and more. The solutions need to be designed to be reliable and survive under such conditions. Kontron offers PC/104 SBCs including Intel® Atom™ and Core™ Duo processor offerings within the MICROSPACE® family that do just that. Kontron uses industrial-grade components for by-design solutions that can withstand the harsh conditions. Additionally, 100 percent extended temperature tested solutions are available to ensure the solution meets the application-specifi c temperature requirements.

Kontron Kontron Small Form Factor PC/104 SBCs


PC/104

The low power PCM-VDX-2-512 is designed for headless space- and power-limited systems. With its diverse range of functions, most applications will not require additional I/O cards; however, it has onboard Mini PCI and PC/104 connectors for specialty I/O expansion. Powered with a 1GHz Vortex86DX processor, the PCM-VDX supports 512MB DRAM and 1MB battery-backed SRAM, with onboard CompactFlash socket and optional 512MB SSD fl ash disk. Its full-featured I/O includes two 10/100 Mbps Ethernet ports, four USB ports, and four serial RS-232/422/485 ports with ESD protection on LAN, USB, and serial ports; it also runs Linux, DOS, and other x86-compatible operating systems in extended temperature environments.

WinSystems, Inc. Fanless, Low Power 1GHz PC/104 SBC

www.winsystems.com smallformfactors.com/p46627

PC/104

PC/104-Plus CPU based on the Intel Atom processor and Intel US15W (Poulsbo) chipset • 1.1 GHz (Z510) and 1.6 GHz (Z530) • Up to 2 GB DDR2 DRAM and up to 8 GB onboard SSD • 8x USB 2.0 ports, 2xRS-232/422/485 COM, LPT, 7.1 HD Audio • 10/100/1000BASE-T Ethernet and GPIO interface • CRT/LVDS, PATA, and SMBus interfaces • Extended temperature version available • Various active and passive cooling options available • Serving the PC/104 industry for over 15 years

Advanced Digital Logic (ADL) ADLS15PC


PC/104-Plus

Advantech recently announced a new full range of embedded boards based on the new Intel® Atom™ Processor E6xx Series (formerly codenamed Tunnel Creek). Advantech’s PCM-3364 (PC/104 in 96 x 90 mm) is a stackable single board computer that integrates all functions including: LVDS, CRT, Ethernet, USB client, Mini-PCI Express, UART, GPIO, CFast, and CANbus onto one small form factor. Designed with fanless thermal solutions for easier system integration, the PCM-3364 is an ideal solution for vehicle, medical, POS, CNC, and extended temperature applications. Advantech also provides multi OS support, including Windows 7, XPe, WinCE, QNX, and Linux.

Advantech Corporation PCM-3364

www.advantech.com smallformfactors.com/p46622

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Combination MIL-STD-1553 and ARINC 429 Test and Simulation Module for PC/104-Plus • One or twoMIL-STD-1553A/B streams • Eight ARINC 429 channels • Single board fully VXI compliant • Ten programmable Input/Output (I/O) lines • Optional PMC slot for third-party PMC boards • Onboard IRIG-B for synchronization

Avionics Interface Technologies PC104p-CMB

www.aviftech.com smallformfactors.com/p46629

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PCI/104-Express (Sponsored by Connect Tech Inc. ww

w.connecttech.com

)

The VDX104+ is a rugged, fanless 800MHz PC/104-Plus CPU module featuring an operating temperature of -40 ºC to +85 ºC, soldered RAM, and RoHS compliancy. This compact, low power package comes standard with 512MB DDR2 RAM, four COM ports, two USB 2.0 ports, and dual 10/100 Ethernet. In addition to8MB onboard SPI Flash (fl oppy emulation), the VDX104+ includes both a Type I CompactFlash™ socket as well as a microSD socket. System expansion is supported by the PC/104-Plus interface.

Tri-M Technologies Inc. VDX104+

www.tri-m.com smallformfactors.com/p46626

PC/104-Plus

800 MHz performance • 3 W typical power draw • DMP Vortex86DX chip • Fully static SoC • Compatibility with Windows, Linux, and other popular 32-bit RTOSs • Supports PC/104 and PC/104-Plus expansion • 128-512 MB soldered-on RAM • Interfaces include two USB 2.0, two RS-232/422/485, 10/100 Ethernet, LPT, IDE, a CompactFlash socket, and a legacy PS/2 interface for keyboard and mouse • Available in commercial and industrial temperature versions • Ruggedized SBC is qualifi ed to MIL-STD-202G shock and vibration standards, enabling deployment in harsh environment applications • Options include conformal coating, connector changes, revision locks, testing and screening, and redesign services

VersaLogic Corp. Tomcat

www.versalogic.com smallformfactors.com/p45036

PC/104-Plus

Based on the Small Form Factor (SFF) Intel Celeron M/Core 2 Duo & Intel GS45/ICH9M-E chipset • Up to 4GB DDR3-1066 MHz DRAM • 2x 10/100/1000Mbit LAN controllers • CRT/LVDS interface onboard• 4x SATA Generation 2 (3 Gb/s) with onboard RAID 0/1 support • 8x USB 2.0 ports, COM1, COM2, and LPT1 • SMBus interface, real-time clock, watchdog timer, and 8-channel HD Audio • Various active and passive cooling options available • PCIe v1.1 - 4 x1 or 1 x4 Lanes, or x16 PEG • Serving the PC/104 industry for over 15 years

Advanced Digital Logic (ADL) ADLGS45PC


PCI/104-Express

88 Watt Synchronous Poly Phase Power Supply • +90% effi ciency at full load • Synchronized design to reduce surge-induced EMI • Wide input voltage range • Low input ripple current • Low output ripple voltage • Status LEDs placed conveniently next to PCI Express bus for easy viewing • Reverse polarity protection to 40 Volts • Continuous output short circuit protection • Input voltage transient protection• Remote ON/OFF operation available • Operating temperature: -40 °C to +85 °C

RTD Embedded Technologies, Inc. ATX104-Express

www.rtd.com smallformfactors.com/p46618

PCI/104-Express

Complete PC-compatible PCI/104-Express Single Board Computer • PCI-104 and PCIe/104 Type 1 & Type 2 buses • Intel Core 2 Duo (1.20 GHz or 1.86 GHz) and Intel Celeron 1.20 GHz • 1 GB or 2 GB surface-mounted dual-channel DDR2 memory • Eight x1 PCIe links, one x16 PCIe link (confi gurable as one x8 or one x4)• Onboard SATA fl ash disk up to 8 GB and two external SATA ports • Six USB 2.0 ports, four on the stackable PCIe bus • Gigabit Ethernet, Analog VGA & LVDS panel, four serial ports • Advanced Digital I/O (aDIO), 14 I/O with interrupts • Advanced Analog I/O (aAIO), 8-channel, 16-bit A/D, or HD audio • 1.86 GHz:-40 °C to +70 °C, 1.20 GHz: -40 °C to +85 °C operating temperature

RTD Embedded Technologies, Inc. CMA22MVD

www.rtd.com smallformfactors.com/p44442

PCI/104-Express

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Connect Tech’s PCI/104-Express Single Board Computers offer a variety of embedded processor solutions including Intel Atom, Freescale i.MX51, TI OMAP and Nvidia Tegra • Our single board computers give instant access to a full range of PCI/104-Express peripherals from a rapidly growing ecosystem including FPGA solutions, multi-port serial, frame grabbers and more• Xtreme/CPU solutions are modular and completely scalable, with access to the most current embedded processors that are easily upgradable to accommodate future generations of Intel Atom processors, such as Tunnel Creek, or ARM based processors, such as Cortex A8 • Depending on your choice of processor module, Xtreme/CPU solutions provide on-board connectors allowing for instant access to a variety of features including 2x SATA, 1x Gigabit Ethernet, LVDS, 4x USB 2.0, VGA Video, 2x RS-232, 2x RS-422/485 • Xtreme/CPU is an ideal off-the-shelf solution for a broad range of applications. Achieve rapid proof of concept and deploy systems for fi eld trials with off-the-shelf hardware • Engineering Services: Benefi t from Connect Tech’s modifi ed designs. Our engineering team is skilled at creating customer-specifi c products that ensure both time to market and price targets are met • For detailed information about Connect Tech’s Xtreme/CPU – PCI/104-ExpressSingle Board Computer, please visit our website at http://www.connecttech.com/sbc.

Connect Tech Inc. Xtreme/CPU – PCI/104-Express Single Board Computer

www.connecttech.com or [email protected] smallformfactors.com/p46031 Now supports TUNNEL CREEK!

PCI/104-Express

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Choose from Pico-I/O USB device featuring SUMIT stacking connector and up to four I/O expansion boards in SUMIT stack or wired high-speed USB 2.0 device • 8 individually optically isolated inputs • Polarity insensitive AC/DC inputs accept up to 31 VDC or AC RMS • Jumper selectable fi ltering per input channel for AC or voltage transients • 4 optically isolated fully protected FET high-side switch outputs • Outputs capable of switching from 5-34 VDC at up to 3A • Two general purpose 16-bit A/D inputs with optional 4-20mA • Custom high-speed function driver • Extended temperature • Optional USB connector allows for standard USB connectivity

ACCES I/O Products, Inc. Multifunction Pico-I/O Modules

www.accesio.com smallformfactors.com/p46623

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The compact “Leopard” embedded computer offers amazing performance with its Intel® Core™2 Duo processor. This rugged dual board computer is backed by VersaLogic’s long-term (5+ year) product availability guarantee and legendary quality.

2.26 GHz Intel Core 2 Duo processorUp to 4 GB DDR3 RAMMid power, 21W (typical)PC/104-Plus expansionSmall footprint (4.2” x 3.8”)Industrial temp. (-40º to +85ºC) versionDual gigabit EthernetHigh-performance video and audio

Evaluate the Leopard today! Customization is available even in low volumes.

With more than 30 years experience delivering extraordinary support and on-time delivery VersaLogic has perfected the art of service, one customer at a time. Experience it for yourself. Call 800-824-3163 for more information!

The Leopard moves FAST! Ultra-high performance PC/104-Plus Core 2 Duo

800-824-3163 | 541-485-8575 | www.VersaLogic.com / lep

Recipient of the VDC Platinum Vendor Award

for five years running!


Multiprotocol PCI Express avionics communication board • Supports up to two independent 4000 family avionics communication modules, allowing different protocols to be mixed and matched on a single card • Supports fast DMA transfers for reducing processor and system latency time • Supports the following protocols: ARINC 429/575, ARINC 708/453, discrete I/O, serial RS-232/422/485, CAN 2.0 • Supports error-injection and -detection capabilities • Available in an extended operating temperature range of -40 °C to +85 °C • Supplied with C drivers, including source code and Mystic software for Windows • Fully compatible with Excalibur’s Exalt Plus Data Analysis and Laboratory Tools

Excalibur Systems, Inc. EXC-2000PCIe

www.mil-1553.com smallformfactors.com/p43496

Rugged/Mil-Spec

Rugged, industrial PC with fanless design delivers high-reliability operation • 4 plug-in I/O module slots provide easy, low-cost interface to instrumentation • High-density, interchangeable I/O modules enable mix and match fl exibility • 20+ I/O modules available for a wide variety of analog, digital, and serial I/O functions • Thermally controlled chassis meets extreme operating temperature requirements • Compact shock- and vibration-resistant design

Acromag IOS-7400

www.acromag.com smallformfactors.com/p43878

Rugged/Mil-Spec

Eurotech’s Catalyst TC is a deeply embedded, highly integrated module based on the Intel® Atom™ E6xx processor and Intel® PCH EG20T companion chip. The Catalyst TC showcases a long list of features directly on the module such as SATA, Gigabit Ethernet, CAN, and multimedia interfaces. Compliant with the PCIe standard, the fl exible Catalyst TC allows any PCIe-compliant device to be easily connected, thereby expanding theI/O support and freeing up carrier board designs to focus on minimizing space and size usage while optimizing capabilities. With so much performance in a low-power design, Eurotech’s Catalyst TC is ideal for OEMs looking for greater integration, fl exibility, and cost optimization in their designs.

Eurotech Catalyst TC


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Aurora is a rugged SUMIT-ISM form factor SBC based on the 1.6GHz Intel Atom Z530 CPU. Aurora supports up to 2GB of SO-DIMM SDRAM and provides high-resolution LVDS and SDVO graphics. I/O ports include SATA, USB, serial, digital I/O, Gigabit Ethernet, and optional on-board USB fl ash disk. Flexible system expansion is based on stackable PC/104 and SUMIT-A modules. Aurora’s power-effi cient design leverages Intel’s ultra-low-power Atom Z530P processor and US15W chipset, which are positioned on the board’s underside for effi cient heat removal via a heatspreader for wide-temperature, fanless operation.

Diamond Systems Corporation Aurora

www.diamondsystems.com smallformfactors.com/p46244

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The PCM-3362's design is based on the PC/104+ form factor and provides

expansion support via ISA & PCI Busses. The PCM-3362 gives developers

a low power, low cost and scalable platform that can fit into the tightest

places. On-board features include: 3 serial ports, 4 USB 1.1/2.0 ports, a

Gig Ethernet port, an Audio port and a PS/2 keyboard/mouse interface. For

Rugged applications the 2GB of on-board flash can be utilized in place of a

hard drive. Pricing starts at $339.00 and includes integration and testing!For more info visit:

www.emacinc.com/sbc_pc_compatible/pcm_3362.htm

Additional products available at www.smallformfactors.com

ADLINK Technologywww.adlinktech.com www.smallformfactors.com/p43610

Avionics Interface Technologieswww.aviftech.com www.smallformfactors.com/p46240

Axiomtekwww.axiomtek.comwww.smallformfactors.com/p45437

congatecwww.congatec.us www.smallformfactors.com/p46032

Diamond Systems Corporationwww.diamondsystems.comwww.smallformfactors.com/p46521

EMAC, Inc.www.emacinc.comwww.smallformfactors.com/p41262

Emerson Network Power Embedded Computingwww.emerson.com/EmbeddedComputing www.smallformfactors.com/p46216

Eurotechwww.eurotech.com www.smallformfactors.com/p35716

Evoc Technologywww.evoc.com www.smallformfactors.com/p44438

Excalibur Systems, Inc.www.mil-1553.comwww.smallformfactors.com/p45234

LiPPERT Embedded Computerswww.lippertembedded.comwww.smallformfactors.com/p46027

Sealevel Systems, Inc.www.sealevel.comwww.smallformfactors.com/p43572

VersaLogic Corp.www.versalogic.comwww.smallformfactors.com/p45445

VIA Technologieswww.via.com.tw www.smallformfactors.com/p46182

WIN Enterpriseswww.win-ent.comwww.smallformfactors.com/p42796

WinSystemswww.winsystems.comwww.smallformfactors.com/p46015


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SFF Rx for medical device design challengesThe American people have spoken about which candidates they want in office this election season, but the discussion on what to do about health care is far from over.

As politicians continue to debate the pros and cons of Obamacare, medical device developers are working on innovative devices and equipment that can minimize operating costs and improve patient care. The embedded technologies powering these devices are helping create medical breakthroughs and revolutionizing the health care industry in emerging fields such as telehealth, which will be highlighted in our upcoming E-cast entitled “Enabling Telehealth Devices with Embedded Computing” (register at ecast.opensystemsmedia.com).

Several embedded technology vendors are taking advantage of this momentum and developing Small Form Factor (SFF)-related products that fulfill the need for secure, convenient solutions cer-tified to strict rules and regulations. The following excerpts from a recent Intel Embedded Community blog series explore how SFF companies are addressing the numerous technical challenges specific to medical device design.

Portability and low power consumptionIn a 2009 report, Gartner identified mobile health monitoring as one of the top 10 consumer mobile technologies for 2012, citing its potential for reducing costs and improving quality of life for patients. SFFs are particularly suited to mobile medical applica-tions, as they offer low power consumption and the ability to be unplugged and powered by batteries.

Medical tablets including Advantech’s MICA-101 and Arbor Technology’s M1255 maintain low Thermal Design Power (TDP) while providing a consolidated view of patient data in a convenient platform suited for clinical environments. Bedside infotainment stations such as Avalue Technology’s MTP-1503 help health care providers avoid the trouble of back-and-forth recharging as devices are used on the go.

COM Express modules are especially useful in medical designs because they enable I/O to be customized while providing a wide processor and power selection to meet market demand. Intel Atom-based COM Express and Pico-ITX products from RadiSys such as the Procelerant Z500 and PICOZ500 have been successfully deployed in patient monitoring and portable ultra-sound equipment.

Long life supportIn medical imaging, a picture is worth a thousand words and several gigabytes of data. MRI and CT scans, mass-spectrometry, phenotyping, and genetic studies generate hundreds of terabytes of data that must be processed and stored by powerful supercom-puters, like the Intel Xeon-based SGI Altix UV being used to sup-port the efforts of the Institute of Cancer Research in England.

Medical equipment manufacturers want their end products to sell for 5-10 years to recoup ROI from their investments in these “big iron” machines.

To help ensure long-term operation, Corvalent “overengineers” its motherboards using various processes, from conformal coating

to board-level design changes. For example, the Corsys-M10 Medical Tablet is designed to withstand common hospital chemi-cals and significant physical abuse for reliable performance in its intended environment.

Kontron partners with strategic suppliers to extend the life of its products for medical environments, such as its ETXexpress base-board and ETXexpress-CD video frame grabber used in dental imaging systems.

“We are seeing faster turnover because of the rapid pace of change in technology, and for this reason, we go with Computer-On-Module (COM) technology so the computer can scale with the application as processor performance improves,” Kontron’s Jack London stated during the Q&A session of a webcast earlier this year.

Accuracy, reliability, interoperabilityProviding an interconnected personal telehealth system wherein physicians can remotely prescribe treatments and patients can monitor their health status requires accurate, reliable information communicated via interoperable devices. This priority represents the objective of the Continua Health Alliance, a nonprofit coali-tion of health care and technology companies.

Eurotech, a member of Continua, uses standardized form factors like COM Express, EPIC, and PC/104-Plus when developing prod-ucts for medical deployments, such as the Helios edge controller platform. The company develops its platforms using processes to ensure robust design with reliable signal integrity, EMI, and thermal performance, helping OEMs achieve FDA certification.

To meet certification requirements, medical systems need operating systems built for safety-critical reliability, such as those offered by LynuxWorks. These OSs have been used in high- end imaging, life support, and bedside patient monitoring applications, including a recent proof-of-concept platform that connected more than 25 wireless biometric sensors using a Portwell Mini-ITX board and the LynxSecure real-time hyper-visor and separation kernel to isolate the Bluetooth networking stack from other system software.

The Continua Health Alliance is striving to make medical system design and interoperability easier for companies by reducing the complexity of standards and providing events, training, and a rigorous certification program.

“Companies are transitioning their products to target the broad, international, standards-based market and leveraging the tools and resources Continua has to offer to minimize effort and ensure high quality,” said Rick Cnossen, Continua’s president and chair of the board of directors.

Better, cheaper, easier – these are the words you want to describe the equipment used to manage your health. For more innovative ideas in technologies for medical applications, see our Telehealth channel at channels.opensystemsmedia.com/Telehealth and check out the telehealth virtual panel discussion in the December issue of our sister publication, Embedded Computing Design (www.embedded-computing.com).

* available Q1/2011

* available Q1/2011


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LiPPERT Embedded Computers Inc. 5555 Glenridge Connector, Suite 200 Atlanta, GA 30342Phone (404) 459 2870 · Fax (404) 459 [email protected] · www.lippertembedded.com

* available Q1/2011

Embedded PCs COMplete!COM Module with Intel® Atom™ Processor E6xxT/EG20T

CoreExpress-ECO2 Module• Smallest COM module standard, 65x58mm• CPUs E620T, E640T, E660T and E680T• Up to 2 GB soldered DDR2 RAM• Processor independent standard (sff-sig.org)• Especially designed for battery-driven mobile systems• CPU + Chipset: max. 5 watts Thermal Design Power (TDP)• CAN controller• Shock and vibration resistant• Wide temperature range (-40°C ... +85°C)• Fail-safe BIOS support for remote BIOS update• Condition monitoring using LEMT (new: with power sense)• Module availability 10 years

Toucan-TCCOM Express-Compact Module• COM Express form factor, 95x95mm, Type 2 pinout• CPUs E620T, E640T, E660T and E680T• Up to 2 GB soldered DDR2 RAM• SATA SSD, max. 64 GB, soldered• MicroSD card slot• CAN and 4 COM ports on option connector• Shock and vibration resistant• Wide temperature range (-40°C ... +85°C)• Fail-safe BIOS support for remote BIOS update• Condition monitoring using LEMT (new: with power sense)• Module availability 10 years

* available Q1/2011

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Call 817-274-7553 or Visit www.winsystems.com /EBC-Z510

Embedded Atom™ SBCwith SUMIT ExpansionRuns Fast, Stays CoolOur fanless EBC-Z510-G is a powerful, next-generation EBX-size computing platform. Its outstanding complement of onboard I/O is augmented with MiniPCIe, SUMIT, and PC/104 connectors for high-bandwidth PCIe and USB 2.0interfaces plus standard legacy bus expansion. This extended temperature SBC is compact and flexible enough to meet a broad range of application requirements.

• Low power Intel® Atom™ processor:fanless 1.1GHz or 1.6GHz with fan

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Contact our factory application engineers for additionalproduct information, custom configurations, and pricing.

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